| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure absorption strength by an electrostatic chuck, and to clean the inside of a chamber. <P>SOLUTION: A method for cleaning the inside of the chamber 4 comprises a step of mounting a dummy wafer D on the electrostatic chuck 7, controlling the balance of current flowing in electromagnetic coils 3a, 3b, and making a plasma PZ generated in the chamber 4 move in the vertical directions. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
