LIQUID DROP APPLYING METHOD, LIQUID DROP APPLYING APPARATUS, DEVICE, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a liquid drop applying method and a liquid drop applying apparatus by which a uniform film and a pattern of minute line width can be formed and quality inferiority such as disconnection is not caused.

SOLUTION: While conducting relative displacement of a liquid drop ejecting head 20 and a substrate 2, liquid drops are ejected from the liquid drop ejecting head 20 and are applied onto a predetermined region of a surface of the substrate 2. The liquid drop is ejected toward the surface of the substrate 2 in a direction crossing a perpendicular direction and when the liquid drop is ejected while conducting relative displacement of the liquid drop ejecting head 20 and the substrate 2, the liquid drop is ejected along a relative displacement direction.

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