发明名称 Method of forming gate oxide layers with multiple thicknesses on substrate
摘要 A method of forming gate dielectric layers with various thicknesses on a substrate. At least a first active region and a second active region are provided on the substrate. A first thermal oxide layer is formed on the substrate. A blanket dielectric layer with a first thickness is deposited overlying the substrate. The dielectric layer and the underlying first thermal oxide layer on the second active region are removed to expose the substrate. A second thermal oxide layer with a second thickness less than the first thickness is formed on the second active region. A first gate is formed on the dielectric layer on the first active region and a second gate is formed on the second thermal oxide layer on the second active region.
申请公布号 US2005112824(A1) 申请公布日期 2005.05.26
申请号 US20030723794 申请日期 2003.11.26
申请人 JONG YU-CHANG;LIU RUEY-HSIN;LIN YI-CHUN;HSU SHUN-LIANG;WU CHEN-BAU;WU KUO-MING 发明人 JONG YU-CHANG;LIU RUEY-HSIN;LIN YI-CHUN;HSU SHUN-LIANG;WU CHEN-BAU;WU KUO-MING
分类号 H01L21/8234;(IPC1-7):H01L21/823;H01L21/336 主分类号 H01L21/8234
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