发明名称 |
Interposer, interposerbehuizing en inrichtingssamenstel, dat deze interposer en interposerbehuizing toepast. |
摘要 |
An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached. |
申请公布号 |
NL1025639(C2) |
申请公布日期 |
2005.05.26 |
申请号 |
NL20041025639 |
申请日期 |
2004.03.04 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
WILLIAM EDWARD BURDICK JR.;JAMES WILSON ROSE |
分类号 |
H01L23/32;H01L23/36;H01L23/498 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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