| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, a method of manufacturing the device, a circuit board, and electronic equipment. <P>SOLUTION: The semiconductor device comprises a semiconductor substrate 10 having electrically connected electrodes 14 inside, a first resin section 20 formed at the central part of the surface of the substrate 10 on which the electrodes 14 are formed, and a plurality of second resin sections 25 formed in the areas of the surface of the substrate 10, on which the electrodes 14 are formed, nearer to the end sections of the substrate 10 than the first resin section 20. The device also comprises a wiring 30 formed on the first resin section 20 from the surfaces of the electrodes 14 and a resin layer 40 formed from the surface of the first resin section 20 to the outside of the second resin sections 25 to cover the wiring 30. The resin layer 40 is formed to expose at least the upper end sections of the second resin sections 25. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
