发明名称 FLEXIBLE WIRING BOARD AND METHOD OF MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board whose thinning is possible, whose flexibility is excellent, which can be used for connection of components and part members having inadequate heat-resistance property, and whose alignment is easy. SOLUTION: The flexible wiring board comprises a flexible transparent resin substrate 14 having total beam transmittance of 70% or more and wiring 12 embedded in the transparent resin substrate so as to expose on the surface of the transparent substrate. The flexible wiring board is thin, superior in bending resistance, capable of low-temperature compression bonding with a photo-curing anisotropically-conductive adhesive taking advantage that the substrate is transparent, easy in alignment, and superior in productivity. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136318(A) 申请公布日期 2005.05.26
申请号 JP20030372575 申请日期 2003.10.31
申请人 SHIN ETSU POLYMER CO LTD 发明人 TANIGUCHI ATSUSHI;YOSHIDA KAZUYOSHI
分类号 H05K1/02;H05K3/20;(IPC1-7):H05K1/02 主分类号 H05K1/02
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