| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device of which the electric characteristics can be improved and the size can be reduced and thinned. SOLUTION: In the electronic device having a multilayer printed board 11A and an FET 12 mounted on the multilayer printed board 11A, a recess 22 is formed on the multilayer printed board 11A, and the FET 12 is packaged in the recess 22. The FET 12 is connected to the multilayer printed board 11A through wires 17. COPYRIGHT: (C)2005,JPO&NCIPI |
