发明名称 METHOD OF MANUFACTURING TRANSPARENT RESIN LIGHT CONDUCTIVE PLATE
摘要 PROBLEM TO BE SOLVED: To provide a method capable of easily manufacturing a transparent resin light conductive plate from a transparent resin original plate in a state where a protective film is stuck, without nipping fine cutting chips between the protective films or without thermally fusing the protective films. SOLUTION: This transparent resin light conductive plate 1 is manufactured by cutting together with the protective film by pushing a cutting blade 4 from above this protective film against the transparent resin original plate 2 of sticking the protective film 3 to a surface. For example, the transparent resin original plate is a methacrylic resin plate and a methacrylic acid methyl-styrene copolymer resin plate. The protective film is a thermoplastic resin film. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005131783(A) 申请公布日期 2005.05.26
申请号 JP20040292340 申请日期 2004.10.05
申请人 SUMITOMO CHEMICAL CO LTD 发明人 WATANUKI MUNEHIKO
分类号 B26F1/44;(IPC1-7):B26F1/44 主分类号 B26F1/44
代理机构 代理人
主权项
地址