METHOD FOR VERIFYING HAIRLINE CRACKS IN A SOLDERED JOINT BETWEEN A COMPONENT AND A PRINTED CIRCUIT BOARD

摘要

The invention relates to a method for verifying hairline cracks in a soldered joint of at least one component on a printed circuit board, said at least one component being connected to the printed board in a material-bonding and electrically conducting manner by means of the soldered joint. According to the inventive method, a subassembly comprising the printed board and at least one component is immersed into a special solution containing coloring pigments, the subassembly that is submerged in the solution is introduced into an exsiccator, a negative pressure is generated in said exsiccator, the exsiccator is aerated and the subassembly is removed from the solution shortly before the special solution reaches the boiling point, the subassembly is dried, and the at least one component is removed from the printed board in order to examine whether a distribution of coloring pigments, which indicates that there are hairline cracks, occurs at the soldered joint.