| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a glass ceramic multilayer circuit board with built-in capacitor which alleviates the centralization of thermal stress generated by a difference in the thermal expansion coefficients of an insulating base material and a dielectric material and comprises a high capacitance capacitor. <P>SOLUTION: The glass ceramic multilayer circuit board with built-in capacitor is formed by forming a capacitor part formed of a dielectric material layer 12 and an electrode layer 13 within the insulating base material having the thermal expansion coefficientα<SB>3</SB>formed of a ceramics sintering material. The dielectric layer 12 is formed of a first dielectric layer 12a formed of a ferro-dielectric material having the thermal expansion coefficientα<SB>1</SB>, elastcity E<SB>1</SB>, material strength S<SB>1</SB>and sintering temperature T<SB>1</SB>, and a second dielectric layer 12b formed of the dielectric material which is formed by dividing the first dielectric material layer 12a into a plurality of sections and has the thermal expansion coefficientα2 and includes 30 mass% of non-crystal glass having the softening temperature of 500°C or less. The first dielectric material layer 12a includes a part which is divided by the second dielectric material layer 12b and has the maximum length L<SB>1</SB>satisfying the relationship of L<SB>1</SB><S<SB>1</SB>/(α<SB>1</SB>-α<SB>3</SB>)×E<SB>1</SB>×T<SB>1</SB>andα<SB>2</SB>-α<SB>3</SB><1.0×10<SP>-6</SP>/°C. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
