| 摘要 |
PROBLEM TO BE SOLVED: To cool a heat generating electronic component by a heat pipe and a heat sink, using a simple adhering means capable of being mounted rigidly. SOLUTION: In the heat protecting device of the electronic component having adhering function, a first heat exchange member 1a, having a connecting surface 4 to a heat medium flow path 2, is molded of an aluminum alloy by a press. A second heat exchange member 1b is fixed to this first heat exchange member 1a by adhering the adhering means, such as an injection connecting, welding, etc. with a resin, and the heat pipe and the heat sink are manufactured. A duct for circulating the heat medium is secured in the interior. The first heat exchange member 1a or the second heat exchange member 1b has a mounting part 8 which can adhere to an electronic device 9. The adhering to the electronic device 9 is carried out by caulking or elastic deformation adhering. COPYRIGHT: (C)2005,JPO&NCIPI
|
