<p>A liquid etching method which comprises blowing a chemically reactive liquid, with a specific speed, to a solid article, an aggregate of solid articles or a gelatinous material to be treated; and a liquid etching apparatus having a mechanism for holding an article or material to be treated and a nozzle structure for blowing a chemically reactive liquid to the article or material to be treated which is held by the mechanism. The method and apparatus allow the significant improvement of the etching rate while maintaining the accuracy of etching.</p>
申请公布号
WO2004075278(A9)
申请公布日期
2005.05.26
申请号
WO2004JP02073
申请日期
2004.02.23
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;MIZUNO, BUNJI;SASAKI, YUICHIRO;NAKAYAMA, ICHIRO;KANADA, HISATAKA