CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE

摘要

Disclosed is a conductive paste which is used for forming a wiring conductor such as a via hole conductor (15) arranged in a multilayer ceramic substrate (11). This conductive paste enables to comparatively arbitrarily control the temperature range within which sintering of the conductive paste occurs during a firing step. Such a conductive paste contains a metal powder, a glass frit and an organic vehicle. An inorganic component, which is not sintered at a temperature at which a ceramic layer (12) of the multilayer ceramic substrate (11) can be sintered in the firing process, is arranged on the surface of each particle of the metal powder. The glass frit has a softening point lower than the above-mentioned sintering temperature by 150-300˚C.