| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist which requires no heating for imidization, and thereby, which does not add unnecessary stress to a substrate and which results in a polyimide image with low out-gas and excellent physical properties, and to provide a method for forming an image by using the photoresist. <P>SOLUTION: The photoresist contains a photo acid generating agent and a polyimide having ≥10 wt.% proportion of ≥2C aliphatic hydrocarbon groups included in the main chain and having 50 to 150°C glass transition temperature. The method for forming an image is carried out by using the above photoresist in steps of forming a photoresist layer on a substrate, irradiating the photoresist layer with light through a mask corresponding to a specified pattern, developing the photoresist film with a developing solution containing an alkali and removing the exposed part to form a positive image. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
