发明名称 CERAMIC WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a ceramic wiring substrate with high dimensional accuracy, even if a green sheet having difference in firing shrinkage between the coating direction and the breadthwise direction vertical to the direction is used, and to provide its manufacturing method. <P>SOLUTION: The ceramic wiring board includes an insulating substrate 3, having a plurality of laminated insulating layers containing at least ceramic particles and a conductor layer 5 on at least the surface of the substrate 3, and anisotropic particles 9, in each insulating layer, are oriented approximately in one direction, and the insulating layers intermingle with their orientation directions intersecting. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136047(A) 申请公布日期 2005.05.26
申请号 JP20030368790 申请日期 2003.10.29
申请人 KYOCERA CORP 发明人 FUKUDA KENJIRO
分类号 C04B35/16;B28B1/30;B28B11/00;H01L23/12;H01L23/13;H01L23/15;H05K3/46 主分类号 C04B35/16
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