| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring substrate which is capable of being easily and surely divided along a border line between mutual wiring substrate regions serving as wiring substrates, and a border line between the wiring substrate regions and a dummy region, upon manufacturing the wiring substrate in the configuration of wiring substrate, especially for dividing into a multitude of wiring substrates and capable of manufacturing the wiring substrates having a high dimensional accuracy. SOLUTION: The manufacturing method of the wiring substrates comprises a process for forming a plurality of rectangular wiring substrate regions 4 arrayed longitudinally and laterally in the rectangular wiring substrate regions 4, at the center part of main surface of a green sheet 6 which becomes a ceramic mother substrate 1, and forming a dummy region 5 on the outer peripheral part of the green sheet 6; a process for forming grooves 2 having rectangular sections along the border lines between mutual wiring substrate regions, and the border lines between the wiring substrate regions 4 and the dummy region 5 on at least the main surface of the green sheet 6 and the main surface opposed thereto, through dicing work; and a process for manufacturing the wiring substrates, by applying the dicing work along the grooves 2 after calcining the green sheet 6 to manufacture the wiring substrates by dividing individually the wiring substrate regions 4. COPYRIGHT: (C)2005,JPO&NCIPI
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