发明名称 REPAIRING MATERIAL SUPPLY MECHANISM
摘要 PROBLEM TO BE SOLVED: To facilitate a repair of the disconnection of the conductor pattern of a printed circuit board and raise the quality of the repair in a repairing material supply mechanism for supplying and holding a repairing material to a repair location when any disconnection is repaired. SOLUTION: The repairing material supply mechanism comprises a feeding pipe 7 for feeding out the repairing material 4 and a suction pipe 9 provided substantially opposing the foregoing pipe. The repairing material 4 is fed out from the feeding pipe 7 by the drive of a feeding part 6, and the repairing material 4 thus fed out is sucked into the suction pipe 9. The repairing material 4 is welded to conductor patterns on opposite sides of a disconnection portion by applying the repairing material 4, opposite sides of which are held as described above, to the disconnection portion and supplying electric power thereto while bringing a welding electrode 5 from an upper portion. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136251(A) 申请公布日期 2005.05.26
申请号 JP20030371646 申请日期 2003.10.31
申请人 NIPPON AVIONICS CO LTD 发明人 KOKUTA TETSUAKI;TAKEUCHI MASATO
分类号 H05K3/22;(IPC1-7):H05K3/22 主分类号 H05K3/22
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