发明名称 INSPECTION METHOD AND INSPECTION DEVICE OF MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device which can inspect electric property without giving blemish on the surface of a connection terminal in a mounting substrate which is not equipped with a test terminal. SOLUTION: In the inspection head 32 of the inspection device 30, two guides 37a, 37c are fixed around the side surface of the mounting substrate 10 on a stage 36 which mounts the mounting substrate 10. A conductive rubber 38 as a conduction portion is arranged at a position of the guide 37a which counters a plating lead cutting plane exposed on the side surface of the mounting substrate 10. The conductive rubber 38 is connected with a connector 34 through internal wiring 39. When the inspection of the mounting substrate 10 is performed by the inspection device 30, the mounting substrate 10 is inserted into the guides 37a, 37c in such a manner that the plating lead cutting plane of the mounting substrate 10 comes into contact with the conduction portion 38. Consequently, electric conduction between an inspection device main body 31 and the mounting substrate 10 is obtained, and inspection of electric property serves as enable. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136067(A) 申请公布日期 2005.05.26
申请号 JP20030369064 申请日期 2003.10.29
申请人 SEIKO EPSON CORP 发明人 TAKAHASHI HIROMASA
分类号 G01R1/06;H05K13/08;(IPC1-7):H05K13/08 主分类号 G01R1/06
代理机构 代理人
主权项
地址