发明名称 |
CMP polishing heads retaining ring groove design for microscratch reduction |
摘要 |
A chemical-mechanical polish (CMP) machine and fabrication process using the same. The CMP machine has a CMP retaining ring comprising: an inner peripheral surface; an outer peripheral surface; a lower surface adapted to contact and depress an upper surface of a polishing pad during chemical mechanical polishing of a lower surface of a substrate. The substrate is contained within the inner peripheral surface of the retaining ring during chemical mechanical polishing. At least a groove on the lower surface of the retaining ring. At least a portion of the groove has a rounded contour. In an aspect, the groove has a semicircle profile. In another aspect, the groove has a semicircle profile and a curved top corner profile at adjacent to the lower surface of the retaining ring. The retaining ring with a curved portion of groove reduces the accumulation of dried slurry in the groove and thus reduces micro-scratches.
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申请公布号 |
US2005113002(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20030720409 |
申请日期 |
2003.11.24 |
申请人 |
CHEN FENG;LIM CING G.;LEONG LUP S.;WANG SIM K. |
发明人 |
CHEN FENG;LIM CING G.;LEONG LUP S.;WANG SIM K. |
分类号 |
B24B37/04;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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地址 |
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