发明名称 |
Method for mounting semiconductor chip and semiconductor chip-mounted board |
摘要 |
By arranging bonding members formed of a gold nanopaste between chip-electrodes and board-electrodes, making the chip-electrodes are brought in contact with the respective board-electrodes via the bonding members and applying ultrasonic vibrations to the bonding members in the contact state, the bonding members are bonded to the board-electrodes and the chip-electrodes.
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申请公布号 |
US2005110161(A1) |
申请公布日期 |
2005.05.26 |
申请号 |
US20040958246 |
申请日期 |
2004.10.06 |
申请人 |
NAITO HIROYUKI;SHIDA SATOSHI;HAJI HIROSHI;MORIKAWA MAKOTO |
发明人 |
NAITO HIROYUKI;SHIDA SATOSHI;HAJI HIROSHI;MORIKAWA MAKOTO |
分类号 |
H01L21/607;H01L23/485;H01L23/498;H01L33/62;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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