SUBSTRATE INSPECTION DEVICE, SUBSTRATE INSPECTION METHOD, AND PROGRAM

摘要

There are provided a device, a method, and a program capable of effectively and accurately detecting a defect such as a crack at the end face of a transparent substrate and an opaque substrate. Furthermore, it is possible to measure the external dimensions of the substrate optically in a non-contact way. The device includes at least one end face inspection mechanism for inspecting the end face of the substrate and image processing means for processing an image of a first imaging area. The at least one end face inspection mechanism is first imaging means for imaging the first imaging area and includes: first imaging means for imaging the first imaging area and arranged on the first main surface side of the substrate so that the optical axis of the first imaging means is substantially orthogonal to the first main surface of the substrate; ring-shaped illumination means having a plurality of light emitting sources arranged in a ring shape so that the plurality of light emitting sources emit light beams to the imaging area in such a manner that the light beams applied from the light emitting sources are inclined with respect to the optical axis of the first imaging means; and first illumination means for illuminating the imaging area in parallel to the optical axis of the first imaging means.