METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND COATING AGENT FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component, in which the adherence of soldering dregs is fully prevented on the side of the component package, which needs to be prevented from being soldered.

SOLUTION: A plastic package 14 or only a part of the plastic package having at least one metal soldering region 4 of the electronic component 1, is coated by a solder adhesion preventing layer 6, which mainly has siloxane, and is fixed on the plastic package 14 in the form of a solution without another solvent additive.

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