| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is molded with a resin and has substantially an even thickness. <P>SOLUTION: The semiconductor device 10 comprises lead members 1, 2, an IGBT 3, a diode 4, spacers 5-8, a signal terminal 9, wire 11, and a molded resin 12. The leads 1, 2 sandwich therebetween the IGBT 3, the diode 4 and the spacers 5, 6 through solders 13-15. The spacers 7, 8 are provided between the lead members 1, 2 to define the distance between the lead member 1 and the lead member 2. The spacers 7, 8 are made of an epoxy resin. One end of the signal terminal 9 is disposed between the lead member 1 and the lead member 2. The wire 11 connects the gate of the IGBT 3 to the signal terminal 9. The molded resin 12 is made of an epoxy resin and molds the lead members 1, 2, IGBT 3, diode 4, spacers 5-8, signal terminal 9 and wire 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
