| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which package thickness can be thinned, without need of the corrosion-proof surface processing of a heat sink in a BGA-type semiconductor package of a cavity-down system. <P>SOLUTION: A plurality of through holes 2a are formed in the heat sink 2 along the periphery of the bonding region of a semiconductor element 1. A wiring board 4, in a shape surrounding the outer periphery of a part where a plurality of the through holes 2a are formed, is bonded to the lower face of the heat sink 2. An opening part is formed in the center of the wiring board 4. When the wiring board 4 is bonded to the heat sink 2, the semiconductor element 1 on the lower face of the heat sink 2 is stored in the opening of the wiring board 4 via a gap, and an inner peripheral edge of the opening is positioned so as to surround a plurality of the through holes 2a. Sealing resin 5 exists on a side opposite to the bonding face of the semiconductor element 1 in the heat sink 2, in the through holes 2a of the heat sink 2 and at the periphery of the semiconductor element 1 stored in the opening of the wiring board 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
