发明名称 OPTIC/ELECTRIC MIXED MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To realize a thickness direction optical coupling section, in which guiding loss is reduced and reliability is made high, in an optic/electric mixed mounting substrate. SOLUTION: An optic/electric mixed mounting substrate 1 is provided with an electric wiring 3 formed on the surface of a substrate 2, an in-surface direction optical wiring 4 formed within the substrate 2, a thickness direction optical wiring 5 which is optically coupled to the in-surface direction optical wiring 4 and guides optical signals along the thickness direction of the substrate 2 and an optical deflection section 6 which is formed in the optical coupling sections of the optical wiring 4 and 5. The thickness direction optical wiring 5 is formed by inserting a transparent body 10 into a hole 20 which goes through along the thickness direction of the substrate 2. The optical deflection section 6 is formed by processing the inserted transparent body 10 with laser light beams LB. The optical wiring 5 is formed along the thickness direction by inserting the transparent body 10 into the hole 20 without generating bubbles that are the problems of the conventional resin filling method. Since the optical deflection section 6 is formed after the insertion of the transparent body 10, it's shape/arrangement precision is secured and the optic/electric mixed mounting substrate, in which guiding loss is reduced and the thickness direction optical coupling section is provided, is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005134488(A) 申请公布日期 2005.05.26
申请号 JP20030367962 申请日期 2003.10.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TERAUCHI RYOICHI
分类号 G02B6/122;H05K1/02;(IPC1-7):G02B6/122 主分类号 G02B6/122
代理机构 代理人
主权项
地址