SUBSTRATE PROCESSING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To perform respective kinds of processing such as electroplating by precisely positioning and holding a substrate at a substrate stage without regard to a difference of the outer diameter of the substrate. SOLUTION: The device is provided with a substrate stage 12 which attachably and detachably holds the substrate W in the state of supporting it horizontally in a vertically movable state, and a positioning guide 54 arranged so as to surround the substrate stage. The positioning guide 54 has a tapered surface 54a which positions the substrate W with respect to the substrate stage 12 in contact with the outer peripheral end face of the substrate W lowered or raised supported horizontally by the substrate stage 12. COPYRIGHT: (C)2005,JPO&NCIPI