| 摘要 |
PROBLEM TO BE SOLVED: To dynamically change inspection judgment reference by considering the quality judging state of a mounted finished product printed board in the setting of an inspection judgement value of a cream solder printing inspection device. SOLUTION: The inspection device comprises a board result display unit 8 for extracting and displaying a solder printing inspection result applied to a soldering defect by board ID; a soldering defect input part 9 for inputting soldering defect information on the printed board mounting an electronic component with respect to the inspection result; and a measured data distribution graph display unit 10 for linking the printed board, the finished product board, and soldering defect information and displaying defect information. The inspection judgment value of the printed board is updated by considering defect information on the finished printed board. COPYRIGHT: (C)2005,JPO&NCIPI
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