HEAD MODULE, LIQUID EJECTION HEAD, LIQUID EJECTOR, PROCESS FOR MANUFACTURING HEAD MODULE, AND PROCESS FOR MANUFACTURING LIQUID EJECTION HEAD

摘要

PROBLEM TO BE SOLVED: To ensure flatness of a nozzle forming plane with high accuracy between head chips. SOLUTION: The head module comprises a head chip 20 arranged with heating resistors, a module frame 11 being stuck to the nozzle sheet in order to support it and provided with a hole for arranging the head chip 20, and a supporting member (a buffer tank 15) provided on the head chip 20 arranged in the head chip arranging hole of the module frame 11 and being bonded to the head chip 20 through a securing part 15e in order to secure the head chip 20. COPYRIGHT: (C)2005,JPO&NCIPI