| 摘要 |
PROBLEM TO BE SOLVED: To form a pattern by applying a lift-off method to a temperature condition which is higher than conventional conditions. SOLUTION: A method comprises steps of forming an lower-layer resin film 102 having a lower opening 112, and an upper layer resin film 103 having an upper opening 113, by using two kinds of polyimide having different solubilities, with the lower opening 112 having a larger area than the upper opening 113; depositing an inorganic film 105 on the resultant and forming at the same time an inorganic pattern 115; and removing the inorganic film 105, by making the lower layer resin film 102 and the upper layer resin film 103 dissolve in a predetermined solvent. COPYRIGHT: (C)2005,JPO&NCIPI |
