| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which provides a plated film with uniform thickness without needing preliminary determination for plating conditions. SOLUTION: A plating apparatus 10 has a plating tank 12, an anode 14 and a cathode 16 arranged in the plating tank. The cathode 16 has at least divided two parts 16A and 16B, and each current flowing in the divided cathode parts is measured with ammeters 22 and 24, is fed back, and controlled. COPYRIGHT: (C)2005,JPO&NCIPI
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