| 发明名称 |
Method for separating wafers bonded together to form a stacked structure |
| 摘要 |
This invention relates to a method for separating at least two wafers ( 1, 2 ) bonded together to form a stacked structure. At least one bending force is applied to all or part of the stacked structure to separate the stacked structure into two parts along a required separation plane. Application particularly for producing a thin semiconducting layer.
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| 申请公布号 |
US2005112847(A1) |
申请公布日期 |
2005.05.26 |
| 申请号 |
US20040947134 |
申请日期 |
2004.09.23 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
MORICEAU HUBERT;FOURNEL FRANK;ASPAR BERNARD |
| 分类号 |
H01L27/12;B26D7/14;B26F3/00;B32B43/00;H01L21/00;H01L21/02;H01L21/20;H01L21/30;H01L21/304;H01L21/44;H01L21/46;H01L21/762;(IPC1-7):H01L21/46 |
主分类号 |
H01L27/12 |
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