| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a circuit board with which a circuit can be formed by conductive paste, without need for heating at high temperatures. <P>SOLUTION: A paste composite containing a material, in which a surface of metal nano particle whose average particle size is 1 to 100nm is covered with an organic compound, is supplied to the surface of the board. Plasma treatment is performed, the organic compound on the surface of the metal nanoparticles is removed, the metal nanoparticles are aggregated, and the circuit is formed. The organic compound on the surface of the metal nanoparticles can be removed by plasma treatment, without the need for calcination at high temperatures, and the circuit can be formed without the need for heating at high temperatures. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
