| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate-processing equipment making in-plane uniformity enhanced by improving the thinness of the film thickness average at the central part of a wafer, with respect to a wafer installed especially in the upper part of a boat in the substrate processing equipment performing temperature control inside a processing chamber. SOLUTION: In the substrate processing equipment, there are provided a first temperature control for carrying out the operation of deflection between a set temperature value and a detected temperature control value and performing a calculation processing via an adder, and a second temperature control for presetting the electric power output value at a desired temperature in the processing chamber to be performed by the set output value. When the temperature becomes a desired temperature, switch over is made from the first temperature control to the second temperature control. COPYRIGHT: (C)2005,JPO&NCIPI
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