发明名称 TITANIUM-BASED FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To form a titanium-based film low in chlorine concentration on a nickel-containing silicide region. SOLUTION: The titanium-based film forming method comprises a step (a) of forming a titanium-containing first conductive layer 107 on a nickel-containing silicide region 105 by using TiCl<SB>4</SB>, and a step (b) of forming a nitrogen/titanium-containing second conductive layer 109 on the first conductive layer 107. In the step of forming the second conductor layer 109 on the first conductive layer 107, one of a chlorine/titanium-containing titanium source substance and a nitrogen source substance is supplied as first supplies 113a, 113b, and 113c, and then the other of the source substances is supplied as second supplies 115a, 115b, and 115c. The first supplies 113a, 113b, and 113c and the second supplies 115a, 115b, and 115c are repeated alternately. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136192(A) 申请公布日期 2005.05.26
申请号 JP20030370701 申请日期 2003.10.30
申请人 APPLIED MATERIALS INC 发明人 TANAKA KEIICHI;SUZUKI TAKASHI;IKEGAMI NARITOMO;MORIMOTO MASAHIRO
分类号 C23C16/14;C23C16/34;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):H01L21/285;H01L21/320 主分类号 C23C16/14
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