发明名称 MULTIPLE-PATTERN WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multiple-pattern wiring board which can have a good outer shape after cutting off surplus portions from a mother board. SOLUTION: The multiple-pattern wiring board comprises the mother board 1 consisting of a rectangular insulator, rectangular extended portions 6 extended outside from a pair of opposite end faces of the mother board 1 respectively, a plurality of wiring board regions 2 arranged in rows and columns at the center of the principal plane of the mother board 1, a plurality of interconnection conductors 5a-5c which are formed in series from one end face side of the pair of end faces to the other end face side through the wiring board regions 2, and electrodes 4b formed in the extended portions 6. The plurality of interconnection conductors 5a-5c are linked together at both ends by linking conductors 4a in the extended portions 6, and at the same time, they are electrically connected to the electrodes 4b via the linking conductors 4a. In the mother board 1, there are cutouts formed on both sides of the root of each of the extended portions 6, and the root of each of the extended portions 6 is continuous with the inner surface of the cutouts 1a. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136105(A) 申请公布日期 2005.05.26
申请号 JP20030369678 申请日期 2003.10.29
申请人 KYOCERA CORP 发明人 TAMARU HIDEKAZU
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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