发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve throughput in a short-time heat treatment in a relatively low temperature zone by uniformly heating a processing chamber easily and thereby heating up and cooling down the processing chamber rapidly. SOLUTION: Outside the processing chamber 1 which stores an object 20 to be heated, one piece at a time, a heating body 2, a heat insulator 3, and an induction heating coil 4 are arranged in this order. The heating body 2, the heat insulator 3, and the induction heating coil 4 are formed in similar figures when viewed in a transverse cross section. When heating the object 20 to be heated inside the processing chamber 1, power is supplied to the induction heating coil 4 from a power supply device 5. When cooling the object 20, the supply of power to the induction heating coil 4 is cut or reduced, while at the same time starting the circulation of cooling water from a cooling device 6 inside a copper pipe 41 which constitutes the induction heating coil 4 or increasing the amount of cooling water circulating inside the copper pipe 41. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005136095(A) 申请公布日期 2005.05.26
申请号 JP20030369508 申请日期 2003.10.29
申请人 KOYO THERMO SYSTEM KK 发明人 ISHIBASHI SATOYUKI
分类号 H01L21/31;(IPC1-7):H01L21/31 主分类号 H01L21/31
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