发明名称 HOUSING FOR A POWER SEMICONDUCTOR MODULE WHICH IS RESISTANT TO HIGH VOLTAGES
摘要 <p>The device has a housing partially filled with insulating material, a power semiconducting component covered by insulating material, a gas-filled volume bounded by an insulating material surface, first and second electrical supply leads fed through the gas-filled volume and into the insulating material and an arrangement for extending or eliminating a leakage path on the surface of the insulation material in a region between the supply leads. The device has a housing partially filled with insulating material (4), a power semiconducting component (7) covered by insulating material, a gas-filled volume (30) bounded by a surface (5) of insulating material, at least one first electrical supply lead (1) and a second supply lead (2) fed through the gas-filled volume and into the insulating material and an arrangement (34) for extending or eliminating a leakage path on the surface of the insulation material in a region between the first and second supply leads recessed into the surface.</p>
申请公布号 EP1474828(B1) 申请公布日期 2005.05.25
申请号 EP20030701416 申请日期 2003.02.13
申请人 ABB RESEARCH LTD. 发明人 MEYSENC, LUC;HAMIDI, AMINA;JOERG, PIEDER;AKDAG, ALPER
分类号 H01L25/07;H01L23/04;H01L23/053;H01L23/10;H01L23/62;H01L25/18;H05K5/06;H05K7/14;(IPC1-7):H01L23/04 主分类号 H01L25/07
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