| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package exhibiting excellent transmission efficiency of high frequency signal. SOLUTION: At a lower part of a through hole 2b in the inner surface of a frame 2, a shelf part 2a having an upper surface mounting a circuit board 6, where a line conductor 6a for connecting a semiconductor element 5 and the central conductor 3b of a coaxial connector 3 electrically is formed on the upper surface, is provided. A thin part 3d having a thickness of 10-50% that of the remaining part is formed at a joint of the central conductor 3b to the line conductor 6a between the forward end on the line conductor 6a side and the end thereof. |
