| 摘要 |
PROBLEM TO BE SOLVED: To make a mounted density high in a mounting technology for semicon ductor chips called MCMs(multi chip module). SOLUTION: The first intermediate wiring 11 and the first CSP 13 (chip size package) are provided on the upper surface of a lower CSP 1. A first interlayer wiring post 20 and the first resin sealed layer 19 are provided around the first CSP 13. The second relay wiring 21 and the second CSP 23 are provided on the upper surface thereof. The second interlayer wiring post 30a (30b) and the second resin sealed layer 29 are provided around the second CSP 23. Then a re-wiring 31, an electrode post 32, an upper-layer resin sealed layer 33, and a solder ball 34 are provided on the upper surface thereof. |
