发明名称 Semiconductor device having bonding pads and probe pads
摘要 An external connection wire is externally connected and is bonded to a portion of a predetermined exposed region of a bonding pad, which is exposed through a bonding pad opening of a passivation film. The bonding pad opening of the passivation film has a polygonal shape that has a plurality of corners, and each of the plurality of corners has an obtuse angle or is chamfered. A probe pad is electrically connected to the bonding pad through a conductive line covered with the passivation film. The passivation film is also located on the probe pad and further includes a probe pad opening, through which a predetermined exposed region of the probe pad is exposed. The probe pad opening has a polygonal shape that has a plurality of corners, and each of the plurality of corners has an obtuse angle or is chamfered.
申请公布号 US6897669(B2) 申请公布日期 2005.05.24
申请号 US20030635492 申请日期 2003.08.07
申请人 DENSO CORPORATION 发明人 ISHIO SEIICHIRO;SUZUKI YASUTOSHI
分类号 H01L21/66;H01L21/3205;H01L21/60;H01L23/485;H01L23/52;H01L29/84;(IPC1-7):G01R31/27;H01L23/58 主分类号 H01L21/66
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