DMD pixel with small-rotated-moved via2 to reduce beam-electrode shorts

摘要

A digital micromirror device with an optimized beam dimple formed over the via2 to provide process margin by increasing the clearance between the beam and the address electrode, thus reducing shorting between the two. This approach assures that when the beam tilts, it will land on its tips prior to making contact between the beam and address electrode, which are at different potentials. Beam dimple optimization is controlled by the characteristics of the via2 located on the lower metal-3 layer of the device.