摘要 |
Disclosed is a method of reducing the conductivity/charge of a layer of group III-V semiconductor doped with Sn. The method includes the steps of: forming an region of SiO<SUB>2 </SUB>on the semiconductor layer; annealing at least the semiconductor layer and the region of SiO<SUB>2 </SUB>at a temperature sufficiently high to cause atoms of the Sn dopant to leach from the semiconductor layer into the region of SiO<SUB>2</SUB>; and removing the region of SiO<SUB>2 </SUB>after the annealing step is performed. The method can be used, for example, during the manufacture of HEMT, PHEMT, MESFET and HBT devices.
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