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发明名称
Chemical Mechanical Polishing Slurry Useful for Copper/Tantalum Substrates
摘要
申请公布号
KR100491061(B1)
申请公布日期
2005.05.24
申请号
KR20007014742
申请日期
2000.12.23
申请人
发明人
分类号
C09K3/14;(IPC1-7):C09K3/14
主分类号
C09K3/14
代理机构
代理人
主权项
地址
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