发明名称 Aperture masks for circuit fabrication
摘要 Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for electronic displays and low-cost integrated circuits such as radio frequency identification (RFID) circuits. In addition, the techniques can be advantageous in the fabrication of integrated circuits incorporating organic semiconductors, which typically are not compatible with wet processes.
申请公布号 US6897164(B2) 申请公布日期 2005.05.24
申请号 US20020076174 申请日期 2002.02.14
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 BAUDE PAUL F.;FLEMING PATRICK R.;HAASE MICHAEL A.;KELLEY TOMMIE W.;MUYRES DAWN V.;THEISS STEVEN
分类号 H05B33/10;C23C14/04;C23C14/24;C23C14/56;G03F7/12;H01L21/336;H01L21/363;H01L29/786;H01L33/00;H01L51/05;H01L51/50;(IPC1-7):H01L21/31 主分类号 H05B33/10
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