发明名称 Method for assembling semiconductor device socket
摘要 A tip end of a stationary terminal section of a contact pin is inserted via a hole of a contact pin supporting plate into a common gap formed by holes, and held there the holes of the first position-restricting plate and the holes of the second position-restricting plate may be slid away from each other in a common plane to grip the end of the stationary terminal section of the contact terminal by the peripheral edges of the holes; the stationary terminal section of the contact terminal may have an engaging portion to be engageable with an open end peripheral edge of the hole in the first position-restricting plate.
申请公布号 US6896546(B2) 申请公布日期 2005.05.24
申请号 US20040845235 申请日期 2004.05.14
申请人 YAMAICHI ELECTRONICS CO., LTD. 发明人 ICHIHARA KENJI;SHIRATORI AZUSA
分类号 H01R33/76;H01L23/32;H01R13/24;H01R43/20;(IPC1-7):H05K1/00 主分类号 H01R33/76
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