发明名称 Method of exposing a semiconductor wafer in an exposer
摘要 A method for exposing a semiconductor wafer in an exposer includes applying a first resist layer on a layer covering an alignment mark. A microscope measuring instrument, which has a visible and an ultraviolet light source, uses the visible light source for aligning the wafer and uses the ultraviolet light source for exposing a region in the first resist layer above the alignment mark without using a mask to free expose the alignment marks. The semiconductor wafer is then developed, the alignment mark is etched free and covered again with a second resist, which is exposed in an exposer in order to transfer a mask structure following an alignment with the alignment mark. The capacity of expensive exposers is thus advantageously increased, and microscope measuring instruments can be used multifunctionally, for example for the free exposure and for the detection of defects.
申请公布号 US6896999(B2) 申请公布日期 2005.05.24
申请号 US20030465294 申请日期 2003.06.19
申请人 INFINEON TECHNOLOGIES AG 发明人 STAECKER JENS;HOMMEN HEIKO
分类号 G03F9/00;(IPC1-7):G03C5/00 主分类号 G03F9/00
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