发明名称 Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing system
摘要 A method and apparatus for a mixed-mode operation of an electrostatic chuck in a semiconductor substrate processing system. The chuck is operated in a voltage mode before and after a processing and is operated in a current mode during the processing to suppress arcing during the processing of a substrate.
申请公布号 US6898065(B2) 申请公布日期 2005.05.24
申请号 US20020205991 申请日期 2002.07.26
申请人 MAYS BRAD;ISHIKAWA TETSUYA;SHOJI SERGIO FUKUDA 发明人 MAYS BRAD;ISHIKAWA TETSUYA;SHOJI SERGIO FUKUDA
分类号 H01L21/683;(IPC1-7):H01T23/00 主分类号 H01L21/683
代理机构 代理人
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