发明名称 |
Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing system |
摘要 |
A method and apparatus for a mixed-mode operation of an electrostatic chuck in a semiconductor substrate processing system. The chuck is operated in a voltage mode before and after a processing and is operated in a current mode during the processing to suppress arcing during the processing of a substrate.
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申请公布号 |
US6898065(B2) |
申请公布日期 |
2005.05.24 |
申请号 |
US20020205991 |
申请日期 |
2002.07.26 |
申请人 |
MAYS BRAD;ISHIKAWA TETSUYA;SHOJI SERGIO FUKUDA |
发明人 |
MAYS BRAD;ISHIKAWA TETSUYA;SHOJI SERGIO FUKUDA |
分类号 |
H01L21/683;(IPC1-7):H01T23/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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