| 摘要 |
By use of a simple structure, also without enlarging thickness and size too much, provided is a light emitting module which can improve heat dissipation of a light emitting component. On a surface of a wiring substrate, a pair of lands face to each other, and two wiring line is connected to the land, respectively. A mounting side outside electrode of a light emitting component is connected to a lead frame to which a light emitting element is die-bonded, and a non-mounting side outside electrode is connected to a lead frame which is connected to the light emitting element through a bonding wire. And, the mounting side outside electrode is bonded to the land by solder, and the non-mounting side outside electrode is bonded to the land by solder and thereby, the light emitting component is mounted on the wiring substrate. A line width of the wiring line at a side to which the mounting side outside electrode of the light emitting component is soldered is made to be larger than a line width of the wiring line at a side to which the non-mounting side outside electrode is soldered.
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