| 摘要 |
A wafer of integrated circuits under test (ICUT) is tested by supplying power to the ICUTs using power and ground traces that extend between rows of the ICUTs in scribe streets. Test information is supplied to each ICUT by transmitting the test information optically onto the entire wafer. A diode on each ICUT receives the optical test information. The ICUT uses the test information to perform a self-test. Each ICUT has a diode for transmitting optical test information. All ICUTs on the wafer transmit results of the self-tests at the same time. A test device receives the optical test information and identifies the information from each of the many ICUTs, one from another. An entire wafer of ICUTs is therefore tested simultaneously without using a probe card either to power an ICUT or to supply test information to or receive test information from an ICUT.
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