发明名称 Multi-pixel electron emission die-to-die inspection
摘要 One embodiment disclosed is a method of detecting defects in objects. A selected surface area of an object is inspected with a multi-pixel electron microscope, and first set of data is generated having signal values representing image content of each pixel thereof. Further selected surface area of the object is inspected with said multi-pixel electron microscope, and second set of data is generated having signal values representing image content of each pixel thereof. Corresponding portions of first and second sets of data are stored in memory. Misalignment between stored portions of the first and second sets of data is detected with resolution of a fraction of a pixel, and the stored portions of first and second sets of data are aligned using subpixel interpolation to correct the detected misalignment therebetween. Finally, corresponding subportions of the aligned portions of first and second sets of data are compared to detect differences therebetween.
申请公布号 US6897444(B1) 申请公布日期 2005.05.24
申请号 US20030702271 申请日期 2003.11.06
申请人 KLA-TENCOR TECHNOLOGIES CORPORATION 发明人 ADLER DAVID L.
分类号 G01N23/225;G01Q30/02;G01Q30/04;H01J37/26;H01J37/29;(IPC1-7):H01J37/153 主分类号 G01N23/225
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